Qualcomm, the leading manufacturer of mobile processors, has announced the launch of its latest Snapdragon 7 Gen 3 Mobile Platform, which promises to deliver premium features such as 5G, AI, and advanced camera capabilities to high- and ultra-high-tier smartphones.
The Snapdragon 7 Gen 3 Mobile Platform is the first in the Snapdragon 7 series to support 5G/4G Dual-Sim Dual Active (DSDA), which allows users to utilize two SIMs when traveling or to separate their work and personal communications. The platform also supports global 5G sub-6 GHz and mmWave bands, as well as Dynamic Spectrum Sharing (DSS) and carrier aggregation, for fast and reliable connectivity.
The platform also boasts a powerful AI engine, which can perform up to 6 TOPS (trillion operations per second) of AI processing, enabling enhanced user experiences such as natural language processing, voice recognition, face detection, and scene segmentation. The platform also features a Hexagon 770 processor, a Spectra 570L image signal processor, and a Kryo 670 CPU, which offer up to 40%, 35%, and 20% performance improvements respectively compared to the previous generation.
The Snapdragon 7 Gen 3 also supports stunning camera capabilities, such as up to 192 MP single camera capture, 4K HDR video recording, and triple camera concurrency for simultaneous zoom, wide, and ultra-wide capture. The platform also supports Qualcomm Quick Charge 5 technology, which can charge a smartphone from 0% to 50% in just 15 minutes.
The Snapdragon 7 Gen 3 Mobile Platform is expected to power the next generation of high- and ultra-high-tier smartphones from leading OEMs, such as Xiaomi, Motorola, Oppo, Vivo, and OnePlus. The platform is expected to be commercially available at the end of 2023.
