MediaTek Dimensity 8300: A Mid-Range SoC with a Powerful Core

MediaTek, a leading chipmaker for mobile devices, is set to launch its new mid-range SoC, the Dimensity 8300. The Dimensity 8300 will be the successor to the Dimensity 8200 and is placed just below the flagship Dimensity 9300. The chip is expected to offer a balance of performance, power efficiency, and connectivity for the mid-range segment.

Table of Contents


The Dimensity 8300 is based on a 4 nm process and features an octa-core configuration divided into three clusters. The first cluster consists of a single Cortex-A715 core, which is the most powerful ARM core to date, clocked at 3.35 GHz. The single Cortex-A715 is designed to handle the most demanding tasks, such as gaming, AI, and multimedia. The second cluster comprises three Cortex-A715 cores, which are optimized for performance and efficiency, clocked at 3.0 GHz. The third cluster includes four Cortex-A510 cores, which are focused on power saving and background tasks, clocked at 2.2 GHz.


The Dimensity 8300 also comes with an ARM Mali G615 GPU, which runs at 850 MHz and supports various graphics APIs, such as Vulkan, OpenGL ES, and OpenCL. The GPU is capable of delivering smooth and immersive gaming experiences, as well as supporting high-resolution displays and HDR content. The Dimensity 8300 also supports up to 16 GB of LPDDR5 RAM and UFS 4 storage, which enable fast data transfer and multitasking.


One of the key features of the Dimensity 8300 is its support for 5G connectivity, which enables faster and more reliable data speeds, lower latency, and wider coverage. The Dimensity 8300 integrates a 5G modem that supports both sub-6 GHz and mmWave bands, as well as dual SIM dual standby (DSDS) and carrier aggregation. The chip also supports Wi-Fi 6, Bluetooth 5.2, GPS, and NFC, which provide a range of wireless options for users.

The Dimensity 8300 is expected to power a number of mid-range smartphones from various brands, such as iQOO, Realme, Xiaomi, and Oppo. Xiaomi already confirmed that its Redmi K70E will debut the Dimensity 8300 later this month. The Dimensity 8300 will compete with other mid-range SoCs, such as the Qualcomm Snapdragon 778G, the Samsung Exynos 1080, and the Huawei Kirin 9000E. The chip will likely offer a competitive edge in terms of its powerful Cortex-X3 core, its 4 nm process, and its 5G capabilities.

The Dimensity 8300 will be officially unveiled on November 21 at 3 PM Beijing time (7 AM UTC) and its introduction will be livestreamed on Weibo. The chip will be the latest addition to MediaTek’s Dimensity series, which aims to bring premium features and performance to the mass market. The Dimensity 8300 will showcase MediaTek’s innovation and leadership in the mobile chip industry.

Share your love

Leave a Reply

Your email address will not be published. Required fields are marked *